| Flow visualization study of molding compound flowing over 100 pin Quad devices in the early studies of plastic molded packaging of microelectronics. The flow field is too complex to model so this flow visualization approach was used to guide the analysis work needed to manage flow induced stresses on the device and the wire bond connections to the device. |
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Flow visualization study of molding compound flowing over 40 Dual-In-Line Packages (DIPs) in the early studies of plastic molded packaging of microelectronics. The flow field is too complex to model so this flow visualization approach was used to guide the work needed to manage flow induced stresses on the device and the wire bond connections to the device. |
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Mold filling profile of a large multi-cavity molding tool for low cost packaging of microelectronic devices. Such large batch operations provided significant cost reductions in the cost of computer chips and enabled the tremendous cost efficiencies that have been realized in consumer electronics. |
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