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Robinson, S. D., Acarlar, M. S., Chen, Y. C., Manzione, L. T., et. al. (1995). Low-cost molded packaging for optical data links. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, 18(2), 235 – 240. Article

Tighe, S. C. & Manzione, L. T. (1988). Simulation of foaming in reaction injection molding. Polymer Engineering and Science, 28(15), 949 - 954. Article


Manzione, L. T. (1990). Plastic Packaging of Microelectronic Devices. New York: Van Nostrand Reinhold.

Manzione, L. T., Editor, (1987). Applications of Computer Aided Engineering in Injection Molding. New York: Macmillan.


See-Through Nuclear Reactor

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University of Hartford unveils nuclear reactor simulator  Video & Article