Skip to Top NavigationSkip to Utility NavigationSkip to SearchSkip to Left NavigationSkip to Content
Mobile Menu


Robinson, S. D., Acarlar, M. S., Chen, Y. C., Manzione, L. T., et. al. (1995). Low-cost molded packaging for optical data links. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, 18(2), 235 – 240. Article

Tighe, S. C. & Manzione, L. T. (1988). Simulation of foaming in reaction injection molding. Polymer Engineering and Science, 28(15), 949 - 954. Article


Manzione, L. T. (1990). Plastic Packaging of Microelectronic Devices. New York: Van Nostrand Reinhold.

Manzione, L. T., Editor, (1987). Applications of Computer Aided Engineering in Injection Molding. New York: Macmillan.