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Eppes, Milanovic, and Quarshie Publish Research Paper

Posted 02/13/2012
Category: Accolades

Heat sink mounted to transistor
Heat sink mounted to transistor

Tom Eppes, associate professor of electrical and computer engineering, CETA; Ivana Milanovic, associate professor of mechanical engineering, CETA; and George Quarshie, electrical engineering student, published the research paper "Finite Element Modeling of a Transistor Heat Sink” in the American Journal of Engineering and Technology Research, Vol. 2, No. 2, pp. 1-8, 2012.

The paper discusses the heat transfer process in a TO-220 transistor package and the benefits of certain design features. Power transistors require heat sinks to dissipate thermal energy and keep junction temperatures below the recommended limit. A significant increase in useful life can be achieved by a small reduction in operating temperature. Parametric studies of heat sink size, emissivity and convective cooling coefficient impact on the steady-state temperature of the assembly were reported. This work was initiated and done in part during the new course ES 591 – Multiphysics Modeling.

The American Journal of Engineering and Technology Research is aimed at providing a platform for researchers, engineers, scientists, and educators to publish their original research results, to exchange new ideas, and to disseminate information in innovative designs, engineering experiences and technological skills.

Heat sink mounted to transistor
Heat sink mounted to transistor

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