Eppes, Milanovic, and Quarshie Publish Research Paper

Heat sink mounted to transistor

Tom Eppes, associate professor of electrical and computer engineering, CETA; Ivana Milanovic, associate professor of mechanical engineering, CETA; and George Quarshie, electrical engineering student, published the research paper "Finite Element Modeling of a Transistor Heat Sink” in the American Journal of Engineering and Technology Research, Vol. 2, No. 2, pp. 1-8, 2012.

The paper discusses the heat transfer process in a TO-220 transistor package and the benefits of certain design features. Power transistors require heat sinks to dissipate thermal energy and keep junction temperatures below the recommended limit. A significant increase in useful life can be achieved by a small reduction in operating temperature. Parametric studies of heat sink size, emissivity and convective cooling coefficient impact on the steady-state temperature of the assembly were reported. This work was initiated and done in part during the new course ES 591 – Multiphysics Modeling.

The American Journal of Engineering and Technology Research is aimed at providing a platform for researchers, engineers, scientists, and educators to publish their original research results, to exchange new ideas, and to disseminate information in innovative designs, engineering experiences and technological skills.